REVERSED
Tech Center 1700 Chemical & Materials Engineering
1711 Ex Parte Heubner et al 12224002 - (D) KIMLIN 112(1)/102/103 BSH HOME APPLIANCES CORPORATION PERRIN, JOSEPH L
Tech Center 2100 Computer Architecture and Software
2163 Ex Parte Hind et al 11946330 - (D) ASTORINO 102/103 IBM CORPORATION RSW IP Law DANG, THANH HA T
Tech Center 2400 Networking, Multiplexing, Cable, and Security
2433 Ex Parte Camenisch 11541017 - (D) McCARTNEY 103 37 C.F.R. § 41.50(b) 101 Anne Vachon Dougherty ANDERSON, MICHAEL D
2469 Ex Parte Childress et al 11254750 - (D) BAHR 103 37 C.F.R. § 41.50(b) 112(2) IBM CORPORATION WILLIAMS, JENEE LAUREN
2471 Ex Parte Dolganow et al 12423600 - (D) STRAUSS 103 Kramer & Amado, P.C. CHOU, ALBERT T
2485 Ex Parte Aliaga et al 10449929 - (D) MORGAN 102 37 C.F.R. 41.50(b) 101 RYAN, MASON & LEWIS, LLP LEE, Y YOUNG
Tech Center 2600 Communications
2694 Ex Parte Damera-Venkata et al 10996083 - (D) LEE 103 HEWLETT-PACKARD COMPANY MOON, SEOKYUN
The Specification plainly distinguishes between a "pixel offset" and "sub-pixel offset," and we see no reason to stray from the presumption that these different claim terms have different meanings. See Chicago Bd. Options Exch., Inc. v. Int'l Sec. Exch., LLC, 677 F.3d 1361, 1369 (Fed. Cir. 2012). Thus, we are persuaded the Examiner erred in finding that the prior art discloded a "pixel offset," as recited in each independent claim.
Tech Center 3700 Mechanical Engineering, Manufacturing, and Products & Design
3715 Ex Parte Abernethy et al 11774003 - (D) ZECHER 102/103 IBM CORP (YA) C/O YEE & ASSOCIATES PC GISHNOCK, NIKOLAI A
AFFIRMED-IN-PART
Tech Center 2100 Computer Architecture and Software
2175 Ex Parte Kim et al 11100635 - (D) GRIMES 102/103 102/103 ROYLANCE, ABRAMS, BERDO & GOODMAN, L.L.P. ORR, HENRY W
Tech Center 2400 Networking, Multiplexing, Cable, and Security
2452 Ex Parte Angwin 11777353 - (D) FETTING 103 103 IBM CORPORATION RSW IP Law GOLABBAKHSH, EBRAHIM
2456 Ex Parte Desai et al 11180072 - (D) FETTING 103 103 PATENTS ON DEMAND, P.A. IBM-RSW MAI, KEVIN S
Tech Center 2800 Semiconductors, Electrical and Optical Systems and Components
2882 Ex Parte Van De Kerkhof et al 11545763 - (D) NAGUMO 102 102 Pillsbury Winthrop Shaw Pittman, LLP (NV) LIU, CHIA HOW MICHAEL
Tech Center 3700 Mechanical Engineering, Manufacturing, and Products & Design
3715 Ex Parte Chalupper 11973553 - (D) HOELTER 102 102 LERNER GREENBERG STEMER LLP YIP, JACK
AFFIRMED
Tech Center 1600 Biotechnology and Organic Chemistry
1611 Ex Parte Gibbons et al 11726041 - (D) PAULRAJ 103 THE PROCTER & GAMBLE COMPANY LOVE, TREVOR M
Tech Center 2100 Computer Architecture and Software
2166 Ex Parte Kilian et al 10731790 - (D) BUI 103 EMC Corporation c/o WOLF, GREENFIELD & SACKS, P.C. PHAM, KHANH B
Tech Center 2400 Networking, Multiplexing, Cable, and Security
2452 Ex Parte Lin 12113947 - (D) FETTING 102/103 HAMILTON DESANCTIS & CHA LLP NGUYEN, THU V
2462 Ex Parte Rong et al 11389752 - (D) FISHMAN 103 Ditthavong Mori & Steiner, P.C. DANIEL JR, WILLIE J
2486 Ex Parte Morad et al 10776541 - (D) DANG 103 Foley & Lardner LLP/ Broadcom Corporation VO, TUNG T
Tech Center 2600 Communications
2642 Ex Parte Bishop 11392366 - (D) PARVIS 103 Krajec Patent Offices, LLC / Sandwave IP, LLC BATISTA, MARCOS
Tech Center 3600 Transportation, Construction, Electronic Commerce, Agriculture, National Security, and License & Review
3688 Ex Parte Cardwell 10977413 - (D) KIM 101 103 CURATOLO SIDOTI CO., LPA MACASIANO, MARILYN G
REHEARING
DENIED
Tech Center 2800 Semiconductors, Electrical and Optical Systems and Components
2822 Ex Parte Wang et al 11602857 - (R) TIMM 103 SLATER & MATSIL, L.L.P. GREEN, TELLY D
